The diffusion behaviors at the Cu-Al solid-liquid interface: A molecular dynamics study
The Cu-Al composite material possesses a large potential value in practical application due to its excellent properties. Whereas the Cu/Al interface is an inevitable issue to be solved both experimentally and theoretically. Thus, the effects of temperature, pressure on atomic interdiffusion along th...
| Main Authors: | , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-03-01
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| Series: | Results in Physics |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2211379719323101 |