Tear-and-Interconnect Domain Decomposition Scheme for Solving Multiscale Composite Penetrable Objects
In this work, the tear-and-interconnect (T&I) surface-integral-equation (SIE) domain-decomposition (DD) approach-previously developed for non-penetrable bodies-, is extended to composite piecewise homogeneous penetrable objects including multiple materials and multiscale features. The main a...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2020-01-01
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| Series: | IEEE Access |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9110559/ |