Highly mechanical and high-temperature properties of Cu–Cu joints using citrate-coated nanosized Ag paste in air
Today, a growing number of third-generation semiconductor-based power devices are used in products that can continuously operate at high temperatures for extended periods of time. Hence, traditional tin-lead and lead-free solders are no longer suitable for modern electronic packaging. A common metho...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2021-02-01
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| Series: | Progress in Natural Science: Materials International |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S1002007120305797 |