Two-Dimensional Models of Thermoelastic Damping for Out-of-Plane Vibration of Microrings With Circular Cross-Section

Thermoelastic damping is an important dissipation mechanism in microresonators. This article presents an analytical model of thermoelastic damping for out-of-plane vibration of microrings with circular cross-section by considering two-dimensional heat conduction. The temperature field of the circula...

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Bibliographic Details
Main Authors: Yongpeng Tai, Ning Chen, Jun Xu, Pu Li
Format: Article
Language:English
Published: IEEE 2020-01-01
Series:IEEE Access
Subjects:
Online Access:https://ieeexplore.ieee.org/document/9272789/