A Study on the Influence of the Cross-Sectional Shape of the Metal-Inserted Retainer Ring and the Pressure Distribution from the Multi-Zone Carrier Head to Increase the Wafer Yield
In this paper, for the purpose of increasing the wafer yield by controlling the non-uniformity of the material removal rate during the chemical mechanical polishing process, the influence of the cross-sectional shape of the metal-inserted retainer ring and the pressure distribution on the wafer and...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2020-11-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2076-3417/10/23/8362 |