Performance Evaluation and Comparison between Direct and Chemical-Assisted Picosecond Laser Micro-Trepanning of Single Crystalline Silicon

Performance Evaluation and Comparison between Direct and Chemical-Assisted Picosecond Laser Micro-Trepanning of Single Crystalline Silicon

The fabrication of micro-holes in silicon substrates that have a proper taper, higher depth-to-diameter ratio, and better surface quality has been attracting intense interest for a long time due to its importance in the semiconductor and MEMS (Micro-Electro-Mechanical System) industry. In this paper...

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Bibliographic Details
Main Authors: Hao Zhu, Zhaoyang Zhang, Kun Xu, Jinlei Xu, Shuaijie Zhu, Anbin Wang, Huan Qi
Format: Article
Language:English
Published: MDPI AG 2018-12-01
Series:Materials
Subjects:
micro-trepanning
single crystalline silicon
picosecond laser
chemical-assisted
laser-material interaction
material removal mechanism
Online Access:http://www.mdpi.com/1996-1944/12/1/41

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http://www.mdpi.com/1996-1944/12/1/41

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