Numerical Analysis of Curing Residual Stress and Deformation in Thermosetting Composite Laminates with Comparison between Different Constitutive Models

Numerical Analysis of Curing Residual Stress and Deformation in Thermosetting Composite Laminates with Comparison between Different Constitutive Models

A multi-physics coupling numerical model of the curing process is proposed for the thermosetting resin composites in this paper, and the modified “cure hardening instantaneously linear elastic (CHILE)„ model and viscoelastic model are adopted to forecast residual stress and defor...

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Bibliographic Details
Main Authors: Jianfeng Dai, Shangbin Xi, Dongna Li
Format: Article
Language:English
Published: MDPI AG 2019-02-01
Series:Materials
Subjects:
thermosetting composite
curing process
multi-physics coupling
residual stress
deformation
Online Access:https://www.mdpi.com/1996-1944/12/4/572

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https://www.mdpi.com/1996-1944/12/4/572

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