The technology of microcircuit assembly on flexible polyimide substrate

The technology of microcircuit assembly on flexible polyimide substrate

The research is devoted to technology of microcircuit assembly on flexible polyimide substrate. It is proved that such microcircuits provide high reliability and have advantage over other IC models when applied in hermetic micro-assemblies in microelectronic devices that operate under high accelerat...

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Bibliographic Details
Main Authors: Plis N. I., Verbitsky V. G., Zhora V. D., Volnistov V. N., Grunyanskaya V. P., Sergeyeva N. N.
Format: Article
Language:English
Published: Politehperiodika 2010-10-01
Series:Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
Subjects:
microcircuit assembly
flexible polyimide carrier
ultrasonic welding
weld quality
Online Access:http://www.tkea.com.ua/tkea/2010/5-6_2010/pdf/10.zip

Internet

http://www.tkea.com.ua/tkea/2010/5-6_2010/pdf/10.zip

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