The technology of microcircuit assembly on flexible polyimide substrate

The technology of microcircuit assembly on flexible polyimide substrate

The research is devoted to technology of microcircuit assembly on flexible polyimide substrate. It is proved that such microcircuits provide high reliability and have advantage over other IC models when applied in hermetic micro-assemblies in microelectronic devices that operate under high accelerat...

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Main Authors: Plis N. I., Verbitsky V. G., Zhora V. D., Volnistov V. N., Grunyanskaya V. P., Sergeyeva N. N.
Format: Article
Language:English
Published: Politehperiodika 2010-10-01
Series:Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
Subjects:
microcircuit assembly
flexible polyimide carrier
ultrasonic welding
weld quality
Online Access:http://www.tkea.com.ua/tkea/2010/5-6_2010/pdf/10.zip
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spelling doaj-2f35b7436d8d4a238811cd88020a8fe02020-11-24T23:23:14ZengPolitehperiodikaTekhnologiya i Konstruirovanie v Elektronnoi Apparature2225-58182010-10-015-64345The technology of microcircuit assembly on flexible polyimide substratePlis N. I.Verbitsky V. G.Zhora V. D.Volnistov V. N.Grunyanskaya V. P.Sergeyeva N. N.The research is devoted to technology of microcircuit assembly on flexible polyimide substrate. It is proved that such microcircuits provide high reliability and have advantage over other IC models when applied in hermetic micro-assemblies in microelectronic devices that operate under high accelerations, shocks and strong radiation.http://www.tkea.com.ua/tkea/2010/5-6_2010/pdf/10.zipmicrocircuit assemblyflexible polyimide carrierultrasonic weldingweld quality
collection DOAJ
language English
format Article
sources DOAJ
author Plis N. I.
Verbitsky V. G.
Zhora V. D.
Volnistov V. N.
Grunyanskaya V. P.
Sergeyeva N. N.
spellingShingle Plis N. I.
Verbitsky V. G.
Zhora V. D.
Volnistov V. N.
Grunyanskaya V. P.
Sergeyeva N. N.
The technology of microcircuit assembly on flexible polyimide substrate
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
microcircuit assembly
flexible polyimide carrier
ultrasonic welding
weld quality
author_facet Plis N. I.
Verbitsky V. G.
Zhora V. D.
Volnistov V. N.
Grunyanskaya V. P.
Sergeyeva N. N.
author_sort Plis N. I.
title The technology of microcircuit assembly on flexible polyimide substrate
title_short The technology of microcircuit assembly on flexible polyimide substrate
title_full The technology of microcircuit assembly on flexible polyimide substrate
title_fullStr The technology of microcircuit assembly on flexible polyimide substrate
title_full_unstemmed The technology of microcircuit assembly on flexible polyimide substrate
title_sort technology of microcircuit assembly on flexible polyimide substrate
publisher Politehperiodika
series Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
issn 2225-5818
publishDate 2010-10-01
description The research is devoted to technology of microcircuit assembly on flexible polyimide substrate. It is proved that such microcircuits provide high reliability and have advantage over other IC models when applied in hermetic micro-assemblies in microelectronic devices that operate under high accelerations, shocks and strong radiation.
topic microcircuit assembly
flexible polyimide carrier
ultrasonic welding
weld quality
url http://www.tkea.com.ua/tkea/2010/5-6_2010/pdf/10.zip
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