The technology of microcircuit assembly on flexible polyimide substrate
The research is devoted to technology of microcircuit assembly on flexible polyimide substrate. It is proved that such microcircuits provide high reliability and have advantage over other IC models when applied in hermetic micro-assemblies in microelectronic devices that operate under high accelerat...
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Politehperiodika
2010-10-01
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Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
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Online Access: | http://www.tkea.com.ua/tkea/2010/5-6_2010/pdf/10.zip |
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doaj-2f35b7436d8d4a238811cd88020a8fe02020-11-24T23:23:14ZengPolitehperiodikaTekhnologiya i Konstruirovanie v Elektronnoi Apparature2225-58182010-10-015-64345The technology of microcircuit assembly on flexible polyimide substratePlis N. I.Verbitsky V. G.Zhora V. D.Volnistov V. N.Grunyanskaya V. P.Sergeyeva N. N.The research is devoted to technology of microcircuit assembly on flexible polyimide substrate. It is proved that such microcircuits provide high reliability and have advantage over other IC models when applied in hermetic micro-assemblies in microelectronic devices that operate under high accelerations, shocks and strong radiation.http://www.tkea.com.ua/tkea/2010/5-6_2010/pdf/10.zipmicrocircuit assemblyflexible polyimide carrierultrasonic weldingweld quality |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Plis N. I. Verbitsky V. G. Zhora V. D. Volnistov V. N. Grunyanskaya V. P. Sergeyeva N. N. |
spellingShingle |
Plis N. I. Verbitsky V. G. Zhora V. D. Volnistov V. N. Grunyanskaya V. P. Sergeyeva N. N. The technology of microcircuit assembly on flexible polyimide substrate Tekhnologiya i Konstruirovanie v Elektronnoi Apparature microcircuit assembly flexible polyimide carrier ultrasonic welding weld quality |
author_facet |
Plis N. I. Verbitsky V. G. Zhora V. D. Volnistov V. N. Grunyanskaya V. P. Sergeyeva N. N. |
author_sort |
Plis N. I. |
title |
The technology of microcircuit assembly on flexible polyimide substrate |
title_short |
The technology of microcircuit assembly on flexible polyimide substrate |
title_full |
The technology of microcircuit assembly on flexible polyimide substrate |
title_fullStr |
The technology of microcircuit assembly on flexible polyimide substrate |
title_full_unstemmed |
The technology of microcircuit assembly on flexible polyimide substrate |
title_sort |
technology of microcircuit assembly on flexible polyimide substrate |
publisher |
Politehperiodika |
series |
Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
issn |
2225-5818 |
publishDate |
2010-10-01 |
description |
The research is devoted to technology of microcircuit assembly on flexible polyimide substrate. It is proved that such microcircuits provide high reliability and have advantage over other IC models when applied in hermetic micro-assemblies in microelectronic devices that operate under high accelerations, shocks and strong radiation. |
topic |
microcircuit assembly flexible polyimide carrier ultrasonic welding weld quality |
url |
http://www.tkea.com.ua/tkea/2010/5-6_2010/pdf/10.zip |
work_keys_str_mv |
AT plisni thetechnologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT verbitskyvg thetechnologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT zhoravd thetechnologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT volnistovvn thetechnologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT grunyanskayavp thetechnologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT sergeyevann thetechnologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT plisni technologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT verbitskyvg technologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT zhoravd technologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT volnistovvn technologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT grunyanskayavp technologyofmicrocircuitassemblyonflexiblepolyimidesubstrate AT sergeyevann technologyofmicrocircuitassemblyonflexiblepolyimidesubstrate |
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