On the reaction mechanism of a hydroxyethylidene diphosphonic acid-based electrolyte for electrochemical mechanical polishing of copper
In the electrochemical mechanical polishing (ECMP) of copper, hydroxyethylidene diphosphonic acid (HEDP) can work with other water treatment agents to suppress electrolysis and smooth the metal surface. According to Faraday's law, a conventional operating potential lower than 4 V vs. SCE limits...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2019-06-01
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| Series: | Electrochemistry Communications |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S1388248119301092 |