The effect of addition of Sn to copper on hot compressive deformation mechanisms, microstructural evolution and processing maps
The high-temperature compressive deformation behavior of a Cu-10 wt.% Sn solid solution alloy was studied in the temperature range of 843–993 K and in the strain rate range of 10−3 – 10 s−1 and the relationships among the flow stress, strain rate and temperature were determined. Based on the data ob...
| Main Authors: | , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2020-01-01
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| Series: | Journal of Materials Research and Technology |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2238785419313912 |