Wafer-Level Vacuum Packaging of Smart Sensors

Wafer-Level Vacuum Packaging of Smart Sensors

The reach and impact of the Internet of Things will depend on the availability of low-cost, smart sensors—“low cost” for ubiquitous presence, and “smart” for connectivity and autonomy. By using wafer-level processes not only for the smart sensor fabrication and integration, but also for packaging, w...

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Bibliographic Details
Main Authors: Allan Hilton, Dorota S. Temple
Format: Article
Language:English
Published: MDPI AG 2016-10-01
Series:Sensors
Subjects:
wafer-level vacuum packaging
hermetic packaging
wafer-to-wafer bonding
smart sensors
microelectromechanical (MEMS)
eutectic bonding
solid-liquid interdiffusion (SLID) bonding
metal-metal bonding
thin-film getter
AuSn
CuSn
AuSi
AlGe
AuIn
Online Access:http://www.mdpi.com/1424-8220/16/11/1819

Internet

http://www.mdpi.com/1424-8220/16/11/1819

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