FlexMEMS-enabled hetero-integration for monolithic FBAR-above-IC oscillators
In this work, a monolithic oscillator chip is heterogeneously integrated by a film bulk acoustic resonator (FBAR) and a complementary metal-oxide-semiconductor (CMOS) chip using FlexMEMS technology. In the 3D-stacked integrated chip, the thin-film FBAR sits directly over the CMOS chip, between which...
| Main Authors: | , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
AIP Publishing LLC
2019-09-01
|
| Series: | Nanotechnology and Precision Engineering |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2589554019300303 |