Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading

Stable microstructure in a nanocrystalline copper–tantalum alloy during shock loading

Shock loading of materials alters the microstructure and considerably degrades mechanical performance. Here, shock loading of a nanocrystalline Cu–Ta alloy is found to induce minor changes to microstructure and mechanical performance, attributed to the annihilation of defects during deformation.

Bibliographic Details
Main Authors: B. Chad Hornbuckle, Cyril L. Williams, Steven W. Dean, Xuyang Zhou, Chaitanya Kale, Scott A. Turnage, John D. Clayton, Gregory B. Thompson, Anit K. Giri, Kiran N. Solanki, Kristopher A. Darling
Format: Article
Language:English
Published: Nature Publishing Group 2020-05-01
Series:Communications Materials
Online Access:https://doi.org/10.1038/s43246-020-0024-3

Internet

https://doi.org/10.1038/s43246-020-0024-3

Similar Items