Extremely Thin Metal Foil Blades as Cutting Tools for Hard and Brittle Materials
The manufacturing costs of semiconductor products such as silicon wafers can be reduced by decreasing the kerf loss. In addition, a decrease in the kerf loss leads to an effective utilization of rare materials, which is environmentally beneficial from the viewpoint of saving resources. This study ai...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2018-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://doi.org/10.1051/matecconf/201822104006 |