Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

Co-Design Method and Wafer-Level Packaging Technique of Thin-Film Flexible Antenna and Silicon CMOS Rectifier Chips for Wireless-Powered Neural Interface Systems

In this paper, a co-design method and a wafer-level packaging technique of a flexible antenna and a CMOS rectifier chip for use in a small-sized implantable system on the brain surface are proposed. The proposed co-design method optimizes the system architecture, and can help avoid the use of extern...

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Bibliographic Details
Main Authors: Kenji Okabe, Horagodage Prabhath Jeewan, Shota Yamagiwa, Takeshi Kawano, Makoto Ishida, Ippei Akita
Format: Article
Language:English
Published: MDPI AG 2015-12-01
Series:Sensors
Subjects:
wireless power transmission
wafer-level packaging
flip-chip bonding
flexible substrate
rectenna
Online Access:http://www.mdpi.com/1424-8220/15/12/29885

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http://www.mdpi.com/1424-8220/15/12/29885

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