Growth behavior of tin whisker and hillock on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage
It is the first time that tin whisker was observed to grow from shallow surface grains on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage. Stress difference formed by oxidation and intermetallic compound (IMC) reaction was the driving force for whisker formation. Interrelated twin...
Main Authors: | , , , , , , , |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2021-03-01
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Series: | Materials Letters: X |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S2590150821000016 |