Growth behavior of tin whisker and hillock on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage

Growth behavior of tin whisker and hillock on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage

It is the first time that tin whisker was observed to grow from shallow surface grains on Cu/Ni/SnAg micro-bumps under high temperature and humidity storage. Stress difference formed by oxidation and intermetallic compound (IMC) reaction was the driving force for whisker formation. Interrelated twin...

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Bibliographic Details
Main Authors: Ke Lin, Jing Wang, Chenlin Yang, Menglong Sun, Anmin Hu, Yunwen Wu, Huiqin Ling, Ming Li
Format: Article
Language:English
Published: Elsevier 2021-03-01
Series:Materials Letters: X
Subjects:
Electronic materials
Semiconductors
Micro-bump
Tin whisker
Shallow surface grain
Twin boundary
Online Access:http://www.sciencedirect.com/science/article/pii/S2590150821000016

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http://www.sciencedirect.com/science/article/pii/S2590150821000016

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