Electrical Reliability of a Film-Type Connection during Bending

Electrical Reliability of a Film-Type Connection during Bending

With the escalating demands for downsizing and functionalizing mobile electronics, flexible electronics have become an important aspect of future technologies. To address limitations concerning junction deformation, we developed a new connection method using a film-type connector that is less than 0...

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Bibliographic Details
Main Authors: Ryosuke Mitsui, Junya Sato, Seiya Takahashi, Shin-ichiro Nakajima
Format: Article
Language:English
Published: MDPI AG 2015-10-01
Series:Electronics
Subjects:
flexible electronics
film-type connection
plate-to-plate contact
adhesive
bending test
four-probe method
change in resistance
Online Access:http://www.mdpi.com/2079-9292/4/4/827

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http://www.mdpi.com/2079-9292/4/4/827

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