New development of atomic layer deposition: processes, methods and applications

Atomic layer deposition (ALD) is an ultra-thin film deposition technique that has found many applications owing to its distinct abilities. They include uniform deposition of conformal films with controllable thickness, even on complex three-dimensional surfaces, and can improve the efficiency of ele...

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Bibliographic Details
Main Authors: Peter Ozaveshe Oviroh, Rokhsareh Akbarzadeh, Dongqing Pan, Rigardt Alfred Maarten Coetzee, Tien-Chien Jen
Format: Article
Published: Taylor & Francis Group 2019-12-01
Series:Science and Technology of Advanced Materials
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