Devices for quality control of welded joints of leads of packageless chips
The author considers the design and operation of two devices for quality control of welded joints between aluminum leads of packageless microcircuits and contact pads of a thin-film circuit.
| Main Author: | |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
Politehperiodika
2013-06-01
|
| Series: | Tekhnologiya i Konstruirovanie v Elektronnoi Apparature |
| Subjects: | |
| Online Access: | http://www.tkea.com.ua/tkea/2013/4_2013/pdf/09.zip |