CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties

CMOS-MEMS Test-Key for Extracting Wafer-Level Mechanical Properties

This paper develops the technologies of mechanical characterization of CMOS-MEMS devices, and presents a robust algorithm for extracting mechanical properties, such as Young’s modulus, and mean stress, through the external electrical circuit behavior of the micro test-key. An approxima...

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Bibliographic Details
Main Authors: Pei-Zen Chang, Wan-Chun Chuang, Yuh-Chung Hu
Format: Article
Language:English
Published: MDPI AG 2012-12-01
Series:Sensors
Subjects:
pull-in voltage
Young&#8217
s modulus
mean stress
CMOS-MEMS
Online Access:http://www.mdpi.com/1424-8220/12/12/17094

Internet

http://www.mdpi.com/1424-8220/12/12/17094

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