Electrochemical plating of Sn – Ag alloy applicable as a solder
The additions of hydroquinone, 1,4-butandiol and citrate ions to the known strongly acidic sulfate-thiourea solution for electrochemical deposition of Sn – Ag low-melting alloy are proposed, which provide to obtain the alloys of composition near to the eutectic one. It is shown that varying the cont...
Main Authors: | , , , , , |
---|---|
Format: | Article |
Language: | Belarusian |
Published: |
Belarusian State University
2018-05-01
|
Series: | Журнал Белорусского государственного университета: Химия |
Subjects: | |
Online Access: | https://journals.bsu.by/index.php/chemistry/article/view/1225 |