Recent advances in the synthesis of copper-based nanoparticles for metal–metal bonding processes
This review introduces our study on the development of Cu-based nanoparticles suitable as fillers in the metal–metal bonding process. Colloid solutions of various nanoparticles such as cuprous iodide, cupric oxide (CuO), CuO mixed with silver oxide (Ag2O/CuO), cuprous-oxide (Cu2O), metallic Cu, plol...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Elsevier
2016-12-01
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| Series: | Journal of Science: Advanced Materials and Devices |
| Subjects: | |
| Online Access: | http://www.sciencedirect.com/science/article/pii/S2468217916301368 |