Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire

Preparation of Ag2O modified silica abrasives and their chemical mechanical polishing performances on sapphire

Abstract The chemical mechanical polishing (CMP) process has become a widely accepted global planarization technology. The abrasive material is one of the key elements in CMP. In the presented paper, an Ag-doped colloidal SiO2 abrasive is synthesized by a seed-induced growth method. It is characteri...

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Bibliographic Details
Main Authors: Baichun Zhang, Hong Lei, Yi Chen
Format: Article
Language:English
Published: SpringerOpen 2017-06-01
Series:Friction
Subjects:
chemical mechanical polishing
Ag-doped colloidal silica abrasive
sapphire
material removal rate
Online Access:http://link.springer.com/article/10.1007/s40544-017-0156-8

Internet

http://link.springer.com/article/10.1007/s40544-017-0156-8

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