Study on Delamination Between Polymer Materials and Metals in IC Packaging Process

Study on Delamination Between Polymer Materials and Metals in IC Packaging Process

The electronic package interconnects electronic signals from one area to another and package delamination is a serious problem in the configuration of materials. This study focused on decreasing the delamination of the low-profile fine pitch ball grid array (LFBGA) and plastic ball grid array (PBGA)...

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Bibliographic Details
Main Authors: Cheng-Tang Pan, Shao-Yu Wang, Chung-Kun Yen, Chien-Kai Ho, Jhan-Foug Yen, Shi-Wei Chen, Fan-Rui Fu, Yi-Tzu Lin, Cing-Hao Lin, Ajay Kumar, Yow-Ling Shiue
Format: Article
Language:English
Published: MDPI AG 2019-05-01
Series:Polymers
Subjects:
LFBGA
PBGA
delamination
contact angle
XPS
FEA
Online Access:https://www.mdpi.com/2073-4360/11/6/940

Internet

https://www.mdpi.com/2073-4360/11/6/940

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