Pan, C., Wang, S., Yen, C., Ho, C., Yen, J., Chen, S., . . . Shiue, Y. (2019). Study on Delamination Between Polymer Materials and Metals in IC Packaging Process. MDPI AG.
Chicago Style (17th ed.) CitationPan, Cheng-Tang, et al. Study on Delamination Between Polymer Materials and Metals in IC Packaging Process. MDPI AG, 2019.
MLA (8th ed.) CitationPan, Cheng-Tang, et al. Study on Delamination Between Polymer Materials and Metals in IC Packaging Process. MDPI AG, 2019.
Warning: These citations may not always be 100% accurate.