Effects of anisotropy on single-crystal SiO in nano-metric cutting
The nano-metric cutting process of single-crystal SiO 2 was studied using molecular dynamics simulation, where the effects of anisotropy on material removal and surface integrity were analyzed. The typical crystal directions on different crystal planes of SiO 2 were selected as cutting directions. T...
| Main Authors: | , , , , , , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
SAGE Publishing
2020-02-01
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| Series: | Advances in Mechanical Engineering |
| Online Access: | https://doi.org/10.1177/1687814019895163 |