Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy

Effects of Yttrium Addition on the Microstructure Evolution and Electrochemical Corrosion of SN-9Zn Lead-Free Solders Alloy

Electrochemical corrosion behavior of ternary tin-zinc-yttrium (Sn-9Zn-xY) solder alloys were investigated in aerated 3.5 wt.% NaCl solution using potentiodynamic polarization techniques, and the microstructure evolution was obtained by scanning electron microscope (SEM). Eight different composition...

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Bibliographic Details
Main Authors: Wenchao Yang, Jun Mao, Yueyuan Ma, Shuyuan Yu, Hongping He, Da Qi, Yongzhong Zhan
Format: Article
Language:English
Published: MDPI AG 2021-05-01
Series:Materials
Subjects:
lead-free solder
Sn-Zn
electrochemical corrosion
microstructure evolution
Online Access:https://www.mdpi.com/1996-1944/14/10/2549

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https://www.mdpi.com/1996-1944/14/10/2549

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