Hard-Baked Photoresist as a Sacrificial Layer for Sub-180 °C Surface Micromachining Processes

Hard-Baked Photoresist as a Sacrificial Layer for Sub-180 °C Surface Micromachining Processes

This letter proposes a method for utilizing a positive photoresist, Shipley 1805, as a sacrificial layer for sub-180 °C fabrication process flows. In the proposed process, the sacrificial layer is etched at the end to release the structures using a relatively fast wet-etching technique emplo...

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Bibliographic Details
Main Authors: Hani H. Tawfik, Mohannad Y. Elsayed, Frederic Nabki, Mourad N. El-Gamal
Format: Article
Language:English
Published: MDPI AG 2018-05-01
Series:Micromachines
Subjects:
Silicon carbide (SiC)
surface micromachining
photoresist
sacrificial layer
low thermal budget
Online Access:http://www.mdpi.com/2072-666X/9/5/231

Internet

http://www.mdpi.com/2072-666X/9/5/231

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