A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs
A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging....
| Main Authors: | , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE
2021-01-01
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| Series: | IEEE Photonics Journal |
| Subjects: | |
| Online Access: | https://ieeexplore.ieee.org/document/9495256/ |