A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs

A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging....

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Bibliographic Details
Main Authors: Chung-Ping Huang, Ting-Yu Lee, Jhen-Jia Yang, Guan-Teng Lin, Chien-Chung Lin
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Photonics Journal
Subjects:
Quantum dot
light-emitting diodes
heat
Online Access:https://ieeexplore.ieee.org/document/9495256/
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spelling doaj-4849004f91ce4c278b02f3b2f1b6d9fa2021-08-12T23:00:06ZengIEEEIEEE Photonics Journal1943-06552021-01-011341810.1109/JPHOT.2021.30993139495256A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDsChung-Ping Huang0https://orcid.org/0000-0002-4141-3616Ting-Yu Lee1Jhen-Jia Yang2Guan-Teng Lin3Chien-Chung Lin4https://orcid.org/0000-0001-8656-1922Institute of Lighting and Energy Photonics, College of Photonics, National Yang Ming Chiao Tung University, Tainan City, TaiwanInstitute of Photonic System, College of Photonics, National Yang Ming Chiao Tung University, Tainan City, TaiwanInstitute of Photonic System, College of Photonics, National Yang Ming Chiao Tung University, Tainan City, TaiwanInstitute of Lighting and Energy Photonics, College of Photonics, National Yang Ming Chiao Tung University, Tainan City, TaiwanInstitute of Photonic System, College of Photonics, National Yang Ming Chiao Tung University, Tainan City, TaiwanA Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging. Under 1 W&#x002F;cm<sup>2</sup>, the areal temperature decreased from 38.5&#x2009;&#x00B0;C (without Sn-ball) to 32.3&#x2009;&#x00B0;C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package. Specifically, the introduction of the metal ball structure engendered a two- to three-fold increase in lifetime. The study findings could contribute toward integrating quantum dots into photonic devices.https://ieeexplore.ieee.org/document/9495256/Quantum dotlight-emitting diodesheat
collection DOAJ
language English
format Article
sources DOAJ
author Chung-Ping Huang
Ting-Yu Lee
Jhen-Jia Yang
Guan-Teng Lin
Chien-Chung Lin
spellingShingle Chung-Ping Huang
Ting-Yu Lee
Jhen-Jia Yang
Guan-Teng Lin
Chien-Chung Lin
A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs
IEEE Photonics Journal
Quantum dot
light-emitting diodes
heat
author_facet Chung-Ping Huang
Ting-Yu Lee
Jhen-Jia Yang
Guan-Teng Lin
Chien-Chung Lin
author_sort Chung-Ping Huang
title A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs
title_short A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs
title_full A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs
title_fullStr A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs
title_full_unstemmed A Metal-Embedded Packaging Structure for Performance Enhancement in Quantum-Dot-Converted LEDs
title_sort metal-embedded packaging structure for performance enhancement in quantum-dot-converted leds
publisher IEEE
series IEEE Photonics Journal
issn 1943-0655
publishDate 2021-01-01
description A Sn-ball was integrated with a colloidal quantum dot light-emitting diode package to achieve effective heat and reliability management. The electric, optical intensity, and heat distributions of the package were evaluated under various radiant fluxes; data were collected at the 90th hour of aging. Under 1 W&#x002F;cm<sup>2</sup>, the areal temperature decreased from 38.5&#x2009;&#x00B0;C (without Sn-ball) to 32.3&#x2009;&#x00B0;C (with Sn-ball), which helped extend the lifetime of the colloidal quantum dots in the package. Specifically, the introduction of the metal ball structure engendered a two- to three-fold increase in lifetime. The study findings could contribute toward integrating quantum dots into photonic devices.
topic Quantum dot
light-emitting diodes
heat
url https://ieeexplore.ieee.org/document/9495256/
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