CHARACTERIZATION AND MITIGATION OF ELECTRO-STATIC BONDING FAILURES IN MICROSENSORS
Electrostatic bonding between glass and silicon is carried out in micro sensor devices to achieve higher bond strength thus eliminating the requirement of adhesives. This can also be useful in providing hermiticity and results in reliable operation of the micro sensor devices. Practically the se...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
ICT Academy of Tamil Nadu
2017-04-01
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| Series: | ICTACT Journal on Microelectronics |
| Subjects: | |
| Online Access: | http://ictactjournals.in/paper/IJME_Vol_3_Iss_1_Paper_2_345_348.pdf |