Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure the substrate wafer or thin film on wafer tha...

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Bibliographic Details
Main Authors: Chao-Chang A. Chen, Jen-Chieh Li, Wei-Cheng Liao, Yong-Jie Ciou, Chun-Chen Chen
Format: Article
Language:English
Published: MDPI AG 2021-12-01
Series:Applied Sciences
Subjects:
pad dressing
dynamic measurement
CMP
pad uniformity
pad lifetime
Online Access:https://www.mdpi.com/2076-3417/11/1/179

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https://www.mdpi.com/2076-3417/11/1/179

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