Dynamic Pad Surface Metrology Monitoring by Swing-Arm Chromatic Confocal System

• Main Authors: Chao-Chang A. Chen, Jen-Chieh Li, Wei-Cheng Liao, Yong-Jie Ciou, Chun-Chen Chen
• Format: Article
• Language: English
• Published: MDPI AG 2021-12-01
• Series: Applied Sciences
• Subjects: pad dressing; dynamic measurement; CMP; pad uniformity; pad lifetime
• Online Access: https://www.mdpi.com/2076-3417/11/1/179

This study aims to develop a dynamic pad monitoring system (DPMS) for measuring the surface topography of polishing pad. Chemical mechanical planarization/polishing (CMP) is a vital process in semiconductor manufacturing. The process is applied to assure the substrate wafer or thin film on wafer that has reached the required planarization after deposition for lithographic processing of the desired structures of devices. Surface properties of polishing pad have a huge influence on the material removal rate (MRR) and quality of wafer surface by CMP process. A DPMS has been developed to analyze the performance level of polishing pad for CMP. A chromatic confocal sensor is attached on a designed fixture arm to acquire pad topography data. By swing-arm motion with continuous data acquisition, the surface topography information of pad can be gathered dynamically. Measuring data are analyzed with a designed FFT filter to remove mechanical vibration and disturbance. Then the pad surface profile and groove depth can be calculated, which the pad’s index PU (pad uniformity) and PELI (pad effective lifetime index) are developed to evaluate the pad’s performance level. Finally, 50 rounds of CMP experiments have been executed to investigate the correlations of MRR and surface roughness of as-CMP wafer with pad performance. Results of this study can be used to monitor the pad dressing process and CMP parameter evaluation for production of IC devices.