Epoxy Molding Compound Lead Frames With Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes

Epoxy Molding Compound Lead Frames With Silicone Resin for Encapsulating AlGaN-Based UVB Light-Emitting Diodes

In this paper we report epoxy molding compound lead frames (EMC-LFs) with encapsulated silicone as a simple and inexpensive packaging for AlGaN-based ultraviolet-B (UVB) light-emitting diodes (LEDs) displaying high light extracting efficiencies (LEE) and long operation lifetimes. The convex surfaces...

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Bibliographic Details
Main Authors: Tsung-Yen Liu, Shih-Ming Huang, Mu-Jen Lai, Rui-Sen Liu, Yi-Tsung Chang, Wen-Hong Sun, Ray-Ming Lin
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Access
Subjects:
AlGaN
AlGaN-based ultraviolet-B LEDs
packaging
light output power
Online Access:https://ieeexplore.ieee.org/document/9531592/

Internet

https://ieeexplore.ieee.org/document/9531592/

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