Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions

Comprehensive Die Shear Test of Silicon Packages Bonded by Thermocompression of Al Layers with Thin Sn Capping or Insertions

Thermocompression bonding for wafer-level hermetic packaging was demonstrated at the lowest temperature of 370 to 390 °C ever reported using Al films with thin Sn capping or insertions as bonding layer. For shrinking the chip size of MEMS (micro electro mechanical systems), a smaller size of wafer-l...

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Bibliographic Details
Main Authors: Shiro Satoh, Hideyuki Fukushi, Masayoshi Esashi, Shuji Tanaka
Format: Article
Language:English
Published: MDPI AG 2018-04-01
Series:Micromachines
Subjects:
thermocompression bonding
vacuum seal
Al–Al bonding
low temperature bonding
shear fracture strength
fracture mechanism
Sn
Online Access:http://www.mdpi.com/2072-666X/9/4/174

Internet

http://www.mdpi.com/2072-666X/9/4/174

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