The solution for removing tin metalloresist from the surface of PCBs copper conductors
This paper compares velocities of tin and copper etching in solution of different compositions. We identified optimal concentration of based components – nitric acid (4.5 mol / L) and Fe(III) ions (0.18 mol / L). To avoid solution’s worm up and toxic nitric oxides allotment during etching, we propos...
| Main Authors: | , , |
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| Format: | Article |
| Language: | Belarusian |
| Published: |
Belarusian State University
2019-01-01
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| Series: | Журнал Белорусского государственного университета: Химия |
| Subjects: | |
| Online Access: | https://journals.bsu.by/index.php/chemistry/article/view/1237 |