Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints

Sn-Bi solder with different Bi content can realize a low-to-medium-to-high soldering process. To obtain the effect of Bi content in Sn-Bi solder on the microstructure of solder, interfacial behaviors in solder joints with Cu and the joints strength, five Sn-Bi solders including Sn-5Bi and Sn-15Bi so...

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Bibliographic Details
Main Authors: Fengjiang Wang, Ying Huang, Zhijie Zhang, Chao Yan
Format: Article
Language:English
Published: MDPI AG 2017-08-01
Series:Materials
Subjects:
Sn-Bi
solder
intermetallic compound
mechanical property
microstructure
aging
Online Access:https://www.mdpi.com/1996-1944/10/8/920

Internet

https://www.mdpi.com/1996-1944/10/8/920

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