Effect of Bonding Temperature on Microstructure and Mechanical Properties during TLP Bonding of GH4169 Superalloy
The effect of bonding temperature on the microstructure and mechanical properties of transient liquid phase (TLP) joints of GH4169 superalloy was investigated. Joining processes were carried out at 1040–1100 °C for 30 min using BNi-2 solder paste. The results showed that three dist...
| Main Authors: | , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2019-03-01
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| Series: | Applied Sciences |
| Subjects: | |
| Online Access: | http://www.mdpi.com/2076-3417/9/6/1112 |