Effect of Bonding Temperature on Microstructure and Mechanical Properties during TLP Bonding of GH4169 Superalloy

• Main Authors: Qing He, Dongdong Zhu, Duo Dong, Mengjia Xu, Anpeng Wang, Qiancheng Sun
• Format: Article
• Language: English
• Published: MDPI AG 2019-03-01
• Series: Applied Sciences
• Subjects: TLP bonding; GH4169 superalloy; BNi-2 solder paste; microstructure; shear strength
• Online Access: http://www.mdpi.com/2076-3417/9/6/1112

The effect of bonding temperature on the microstructure and mechanical properties of transient liquid phase (TLP) joints of GH4169 superalloy was investigated. Joining processes were carried out at 1040–1100 °C for 30 min using BNi-2 solder paste. The results showed that three distinct microstructural zones were formed in the joint region: an athermal solidification zone (ASZ), consisting of eutectic compounds; an isothermal solidification zone (ISZ), consisting of γ solid solution; and a diffusion affected zone (DAZ), consisting of Ni-Cr rich boride and Cr-Nb-Mo-rich boride compounds. With increasing bonding temperature, the amounts of eutectic compounds in ASZ first decreased and then increased. A eutectic-free joint centerline was obtained at 1080 °C. The maximum bonding shear strength reached 728.03 MPa due to the completion of isothermal solidification. Fractographic studies revealed that the boride compounds in ASZ and the intermetallic compounds in DAZ were the main causes for the failure of joints. The fracture mode of the sample bonded at 1040 °C was brittle, and the fracture path was along the ASZ. However, the fracture mode of the sample bonded at 1080 °C was ductile, and the fracture occurred along the DAZ.