Effect of Bonding Temperature on Microstructure and Mechanical Properties during TLP Bonding of GH4169 Superalloy

Effect of Bonding Temperature on Microstructure and Mechanical Properties during TLP Bonding of GH4169 Superalloy

The effect of bonding temperature on the microstructure and mechanical properties of transient liquid phase (TLP) joints of GH4169 superalloy was investigated. Joining processes were carried out at 1040–1100 °C for 30 min using BNi-2 solder paste. The results showed that three dist...

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Bibliographic Details
Main Authors:	Qing He, Dongdong Zhu, Duo Dong, Mengjia Xu, Anpeng Wang, Qiancheng Sun
Format:	Article
Language:	English
Published:	MDPI AG 2019-03-01
Series:	Applied Sciences
Subjects:	TLP bonding GH4169 superalloy BNi-2 solder paste microstructure shear strength
Online Access:	http://www.mdpi.com/2076-3417/9/6/1112

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