A TSV Test Method for Resistive Open Fault and Leakage Fault Coexisting

A TSV Test Method for Resistive Open Fault and Leakage Fault Coexisting

Large-size TSVs have larger parasitic capacitance, which leads to more resolution challenges. At the same time, due to the opposite fault effect of resistive open fault and leakage fault in the ring oscillator, the coexistence of two types of faults will cause serious test confusion. These problems...

Full description

Bibliographic Details
Main Authors: Chang Hao, Xu Yong
Format: Article
Language:English
Published: IEEE 2021-01-01
Series:IEEE Access
Subjects:
Through silicon via
resistive open fault
leakage fault
Schmitt trigger
fault coexisting
Online Access:https://ieeexplore.ieee.org/document/9336637/

Internet

https://ieeexplore.ieee.org/document/9336637/

Similar Items