A TSV Test Method for Resistive Open Fault and Leakage Fault Coexisting

• Main Authors: Chang Hao, Xu Yong
• Format: Article
• Language: English
• Published: IEEE 2021-01-01
• Series: IEEE Access
• Subjects: Through silicon via; resistive open fault; leakage fault; Schmitt trigger; fault coexisting
• Online Access: https://ieeexplore.ieee.org/document/9336637/

Large-size TSVs have larger parasitic capacitance, which leads to more resolution challenges. At the same time, due to the opposite fault effect of resistive open fault and leakage fault in the ring oscillator, the coexistence of two types of faults will cause serious test confusion. These problems significantly increase the difficulty in the TSV test. In this paper, a test method using Schmitt trigger as a TSV receiver is presented to enhance test resolution and reduce test confusion when two kinds of faults exist simultaneously. Schmitt trigger that is characterized by two threshold voltages is used to improve the test resolution. By reducing the supply voltage and checking whether the ring oscillator oscillates, we can identify whether there are two kinds of faults coexisting. HSPICE simulation results based on 45nm CMOS technology demonstrate that the proposed method offers better test resolution in terms of large-size TSVs compared with the existing similar methods, and can distinguish the misdiagnosis when there are two kinds of faults existing simultaneously in a TSV.