Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding

Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding

We reported that highly (111)-oriented nanotwinned gold can be fabricated by periodical-reverse electroplating. The as-deposited films are shown to have a strong (111) preferred orientation, increasing with the reverse current time. The ratios of I<sub>(111)</sub>/I<sub>(220)</s...

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Main Authors: John A. Wu, Chih-Yang Huang, Wen-Wei Wu, Chih Chen
Format: Article
Language:English
Published: MDPI AG 2018-11-01
Series:Materials
Subjects:
gold
nanotwin
preferred orientation
electrodeposition
bonding
Online Access:https://www.mdpi.com/1996-1944/11/11/2287
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spelling doaj-53ab5ecac56a4d5dbad1997cf4188c1b2020-11-25T00:34:54ZengMDPI AGMaterials1996-19442018-11-011111228710.3390/ma11112287ma11112287Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct BondingJohn A. Wu0Chih-Yang Huang1Wen-Wei Wu2Chih Chen3Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanWe reported that highly (111)-oriented nanotwinned gold can be fabricated by periodical-reverse electroplating. The as-deposited films are shown to have a strong (111) preferred orientation, increasing with the reverse current time. The ratios of I<sub>(111)</sub>/I<sub>(220)</sub> and I<sub>(111)</sub>/I<sub>(200)</sub> in X-ray diffraction signals indicates a strong (111) preferred orientation. Using the advantage of the fast surface diffusion of (111) plane compared to the other planes of gold, we performed direct bonding with different thicknesses. Grain growth was observed over two films&#8217; interfaces to eliminate the bonding interface, when annealed at 250 &#176;C for 1 h. Shear tests were performed to gain insight on the bonding quality. All the chips failed at either the silicon substrate or substrate-adhesion layer, showing possible higher strength than the tested maximum, 40.8 MPa.https://www.mdpi.com/1996-1944/11/11/2287goldnanotwinpreferred orientationelectrodepositionbonding
collection DOAJ
language English
format Article
sources DOAJ
author John A. Wu
Chih-Yang Huang
Wen-Wei Wu
Chih Chen
spellingShingle John A. Wu
Chih-Yang Huang
Wen-Wei Wu
Chih Chen
Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding
Materials
gold
nanotwin
preferred orientation
electrodeposition
bonding
author_facet John A. Wu
Chih-Yang Huang
Wen-Wei Wu
Chih Chen
author_sort John A. Wu
title Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding
title_short Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding
title_full Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding
title_fullStr Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding
title_full_unstemmed Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding
title_sort fabrication of (111)-oriented nanotwinned au films for au-to-au direct bonding
publisher MDPI AG
series Materials
issn 1996-1944
publishDate 2018-11-01
description We reported that highly (111)-oriented nanotwinned gold can be fabricated by periodical-reverse electroplating. The as-deposited films are shown to have a strong (111) preferred orientation, increasing with the reverse current time. The ratios of I<sub>(111)</sub>/I<sub>(220)</sub> and I<sub>(111)</sub>/I<sub>(200)</sub> in X-ray diffraction signals indicates a strong (111) preferred orientation. Using the advantage of the fast surface diffusion of (111) plane compared to the other planes of gold, we performed direct bonding with different thicknesses. Grain growth was observed over two films&#8217; interfaces to eliminate the bonding interface, when annealed at 250 &#176;C for 1 h. Shear tests were performed to gain insight on the bonding quality. All the chips failed at either the silicon substrate or substrate-adhesion layer, showing possible higher strength than the tested maximum, 40.8 MPa.
topic gold
nanotwin
preferred orientation
electrodeposition
bonding
url https://www.mdpi.com/1996-1944/11/11/2287
work_keys_str_mv AT johnawu fabricationof111orientednanotwinnedaufilmsforautoaudirectbonding
AT chihyanghuang fabricationof111orientednanotwinnedaufilmsforautoaudirectbonding
AT wenweiwu fabricationof111orientednanotwinnedaufilmsforautoaudirectbonding
AT chihchen fabricationof111orientednanotwinnedaufilmsforautoaudirectbonding
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