Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding
We reported that highly (111)-oriented nanotwinned gold can be fabricated by periodical-reverse electroplating. The as-deposited films are shown to have a strong (111) preferred orientation, increasing with the reverse current time. The ratios of I<sub>(111)</sub>/I<sub>(220)</s...
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doaj-53ab5ecac56a4d5dbad1997cf4188c1b2020-11-25T00:34:54ZengMDPI AGMaterials1996-19442018-11-011111228710.3390/ma11112287ma11112287Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct BondingJohn A. Wu0Chih-Yang Huang1Wen-Wei Wu2Chih Chen3Department of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanDepartment of Materials Science and Engineering, National Chiao Tung University, Hsinchu 30010, TaiwanWe reported that highly (111)-oriented nanotwinned gold can be fabricated by periodical-reverse electroplating. The as-deposited films are shown to have a strong (111) preferred orientation, increasing with the reverse current time. The ratios of I<sub>(111)</sub>/I<sub>(220)</sub> and I<sub>(111)</sub>/I<sub>(200)</sub> in X-ray diffraction signals indicates a strong (111) preferred orientation. Using the advantage of the fast surface diffusion of (111) plane compared to the other planes of gold, we performed direct bonding with different thicknesses. Grain growth was observed over two films’ interfaces to eliminate the bonding interface, when annealed at 250 °C for 1 h. Shear tests were performed to gain insight on the bonding quality. All the chips failed at either the silicon substrate or substrate-adhesion layer, showing possible higher strength than the tested maximum, 40.8 MPa.https://www.mdpi.com/1996-1944/11/11/2287goldnanotwinpreferred orientationelectrodepositionbonding |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
John A. Wu Chih-Yang Huang Wen-Wei Wu Chih Chen |
spellingShingle |
John A. Wu Chih-Yang Huang Wen-Wei Wu Chih Chen Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding Materials gold nanotwin preferred orientation electrodeposition bonding |
author_facet |
John A. Wu Chih-Yang Huang Wen-Wei Wu Chih Chen |
author_sort |
John A. Wu |
title |
Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding |
title_short |
Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding |
title_full |
Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding |
title_fullStr |
Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding |
title_full_unstemmed |
Fabrication of (111)-Oriented Nanotwinned Au Films for Au-to-Au Direct Bonding |
title_sort |
fabrication of (111)-oriented nanotwinned au films for au-to-au direct bonding |
publisher |
MDPI AG |
series |
Materials |
issn |
1996-1944 |
publishDate |
2018-11-01 |
description |
We reported that highly (111)-oriented nanotwinned gold can be fabricated by periodical-reverse electroplating. The as-deposited films are shown to have a strong (111) preferred orientation, increasing with the reverse current time. The ratios of I<sub>(111)</sub>/I<sub>(220)</sub> and I<sub>(111)</sub>/I<sub>(200)</sub> in X-ray diffraction signals indicates a strong (111) preferred orientation. Using the advantage of the fast surface diffusion of (111) plane compared to the other planes of gold, we performed direct bonding with different thicknesses. Grain growth was observed over two films’ interfaces to eliminate the bonding interface, when annealed at 250 °C for 1 h. Shear tests were performed to gain insight on the bonding quality. All the chips failed at either the silicon substrate or substrate-adhesion layer, showing possible higher strength than the tested maximum, 40.8 MPa. |
topic |
gold nanotwin preferred orientation electrodeposition bonding |
url |
https://www.mdpi.com/1996-1944/11/11/2287 |
work_keys_str_mv |
AT johnawu fabricationof111orientednanotwinnedaufilmsforautoaudirectbonding AT chihyanghuang fabricationof111orientednanotwinnedaufilmsforautoaudirectbonding AT wenweiwu fabricationof111orientednanotwinnedaufilmsforautoaudirectbonding AT chihchen fabricationof111orientednanotwinnedaufilmsforautoaudirectbonding |
_version_ |
1725311510350135296 |