Effect of Bi Content on the Microstructure and Mechanical Performance of Sn-1Ag-0.5Cu Solder Alloy
The purpose of this work is to explore the impact of 0.5, 1.5, 2.5 and 3.5 wt.% Bi additions on the microstructure and mechanical performance of Sn-1Ag-0.5Cu solder alloy. Scanning electron microscope (SEM) and X-ray diffraction (XRD) were utilized to examine the microstructure of the present solder...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
MDPI AG
2021-03-01
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| Series: | Crystals |
| Subjects: | |
| Online Access: | https://www.mdpi.com/2073-4352/11/3/314 |