Сonnecting MEMS device for BGA components functional testing

Сonnecting MEMS device for BGA components functional testing

Multiprobe сonnecting device for initial and functional check of electronic components with matrix pin balls has been developed. The device ensures nondefect pneumatic pressing of probes against the terminals.

Bibliographic Details
Main Authors: Nevlyudov I. Sh., Martynyak R. M., Palagin V. A., Slobodyan B. S., Razumov-Frizyuk E. A., Zharikova I. V., Dmytriv M. I., Belyaev A. S.
Format: Article
Language:English
Published: Politehperiodika 2012-02-01
Series:Tekhnologiya i Konstruirovanie v Elektronnoi Apparature
Subjects:
BGA/CSP components
multiprobe connecting device
functional testing
Online Access:http://www.tkea.com.ua/tkea/2012/1_2012/pdf/12.zip

Internet

http://www.tkea.com.ua/tkea/2012/1_2012/pdf/12.zip

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