A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

A MEMS Micro-g Capacitive Accelerometer Based on Through-Silicon-Wafer-Etching Process

This paper presents a micromachined micro-g capacitive accelerometer with a silicon-based spring-mass sensing element. The displacement changes of the proof mass are sensed by an area-variation-based capacitive displacement transducer that is formed by the matching electrodes on both the movable pro...

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Bibliographic Details
Main Authors: Kang Rao, Xiaoli Wei, Shaolin Zhang, Mengqi Zhang, Chenyuan Hu, Huafeng Liu, Liang-Cheng Tu
Format: Article
Language:English
Published: MDPI AG 2019-06-01
Series:Micromachines
Subjects:
MEMS
microfabrication
accelerometer
micro-g
capacitance displacement transducer
through-silicon-wafer-etching
Online Access:https://www.mdpi.com/2072-666X/10/6/380

Internet

https://www.mdpi.com/2072-666X/10/6/380

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