Thermal Analysis of Sintered Silver Nanoparticles Film
Thin bonded films have many applications in antireflection and reflection coating, insulating and conducting films and semiconductor industries. Thermal conductivity is one of the most important parameter for power packaging since the thermal resistance of the interconnections is directly related to...
| Main Authors: | , , , |
|---|---|
| Format: | Article |
| Language: | English |
| Published: |
University of Sistan and Baluchestan (USB) and the Iranian Society of Mechanical Engineers (ISME)
2014-07-01
|
| Series: | Transport Phenomena in Nano and Micro Scales |
| Subjects: | |
| Online Access: | http://tpnms.usb.ac.ir/article_1604_ba0c9ea7b1421e3c22eb94d00b2d3c2b.pdf |