Warpage behavior analysis in package processes of embedded copper substrates
With the advance of the semiconductor industry and in response to the demands of ultra-thin products, packaging technology has been continuously developed. Thermal bonding process of copper pillar flip chip packages is a new bonding process in packaging technology, especially for substrates with emb...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
EDP Sciences
2017-01-01
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| Series: | MATEC Web of Conferences |
| Online Access: | https://doi.org/10.1051/matecconf/201712300014 |