Correlation Between Pin Misalignment and Crack Length in THT Solder Joints
In this manuscript, correlations were searched for between pin misalignments relative to PCB bores and crack propagation after cyclic thermal shock tests in THT solder joints produced from lead-free solder alloys. In total, 7 compositions were examined including SAC solders with varying Ag, Cu and N...
| Main Authors: | , , |
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| Format: | Article |
| Language: | English |
| Published: |
Polish Academy of Sciences
2017-06-01
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| Series: | Archives of Metallurgy and Materials |
| Subjects: | |
| Online Access: | http://www.degruyter.com/view/j/amm.2017.62.issue-2/amm-2017-0154/amm-2017-0154.xml?format=INT |